By The push for faster, smaller, and more efficient electronics is driving a revolution in semiconductor materials, signaling the end of silicon’s reign.
For decades, silicon has been the backbone of the electronics industry. It powered the incredible advancements predicted by Moore’s Law, doubling transistor counts on chips every two years. But now, silicon is hitting a wall.
Chip giants like Intel and TSMC are scrambling. They’re introducing new device architectures, trying to squeeze more performance out of less space. But there’s a broader shift on the horizon. According to a roadmap from imec in Belgium, new materials are set to take over silicon in mass-market devices by the mid-2030s as they move from research labs to commercial production.
The industry isn’t giving up on silicon just yet. Instead, it’s expanding the toolkit with materials that can complement or even replace silicon in certain applications.
Wide-Bandgap Semiconductors Step Up
Wide-bandgap (WBG) semiconductors are leading the charge. Materials like gallium nitride (GaN) and silicon carbide (SiC) are gaining traction for their superior performance in specific areas.
Why WBG Matters
WBG semiconductors have wider bandgaps than silicon, which means they can handle higher voltages and temperatures. This makes them perfect for power electronics, where efficiency and durability are crucial.
- Faster Switching: These materials switch on and off more quickly, allowing for more compact and efficient designs.
- Higher Efficiency: They reduce energy losses, making devices run cooler and consume less power.
- Durability: Their resilience to high voltages and temperatures extends the lifespan of electronic components.
Commercial Success Stories
Silicon carbide has already made a mark in high-demand areas like power inverters, industrial motors, and EV fast chargers. Meanwhile, gallium nitride is making waves in radio-frequency amplifiers and power conversion for consumer electronics.
Table: Characteristics of Most Common WBG Semiconductors vs. Silicon
| Characteristic vs Technology | Silicon | SiC | GaN |
|---|---|---|---|
| Thermal conductivity (Watts/cm²K) | 1.5 | 1.3 | 5.0 |
| Critical breakdown voltage (106 V/cm) | 0.3 | 3.0 | 3.5 |
| Bandgap (eV) | 1.1 | 3.2 | 3.4 |
| Electron mobility (cm²/kV-sec) | 10.0 | 22.0 | 25.0 |
| Electron saturation velocity (106 cm/sec) | 10.0 | 22.0 | 25.0 |
Source: Avnet
Infineon’s acquisition of GaN Systems in 2023 highlights the growing importance of GaN. Analysts at Yole Intelligence predict GaN power device sales will soar from $250 million in 2023 to $2.5 billion by 2029. Meanwhile, IDTechEx expects GaN and SiC sales in the EV power conversion market to surpass silicon by 2035.
Diamond: The Ultimate Power Semiconductor
While GaN and SiC are making significant strides, diamond is emerging as a game-changer for power electronics. Its properties are simply unmatched.
Unparalleled Performance
Diamond boasts an ultrawide bandgap, offering an extremely high breakdown voltage and exceptional thermal conductivity. These features make it ideal for handling massive power loads and dissipating heat efficiently.
Overcoming Manufacturing Hurdles
Growing large diamond wafers has been a major challenge. However, companies like Diamfab in France and Adamas One Corp. in the US have recently achieved single-crystal wafers up to 100 mm in diameter. Reducing defects and controlling doping processes are the next big steps.
“Recent advancements in doping techniques are starting to unlock diamond’s potential,” says Dr. Emily Chen, a researcher at Advent Diamond. “We’re now seeing the first n-channel diamond transistors, which is a huge milestone.”
Long-Term Potential
Diamond’s true promise lies in heavy-duty power applications, especially as the world shifts towards renewable energy. With the ability to handle high power densities and extreme conditions, diamond could revolutionize how we manage and distribute electricity.
The Role of 2D Materials in the Future
Beyond WBG semiconductors and diamond, two-dimensional (2D) materials like graphene are also on the horizon. Discovered in 2004, graphene’s exceptional electrical and thermal conductivities, combined with its mechanical strength, make it a contender for future electronics.
Graphene’s Unique Advantages
Graphene can be fabricated in layers just one atom thick, offering incredible flexibility and integration potential with existing technologies. Its planar geometry allows for high-speed data processing and efficient heat management.
Challenges and Opportunities
Despite its potential, integrating graphene into mainstream electronics remains a challenge. Researchers are focused on scalable production methods and finding ways to leverage its properties without compromising performance.
“Graphene could complement or even replace silicon in certain applications, but we need more breakthroughs in manufacturing,” says Dr. Hiro Tanaka from the University of Tokyo. “The future is bright, but there’s still a lot of work to be done.”
What This Means for the Electronics Industry
The shift towards new semiconductor materials signals a transformative period for the electronics industry. Companies that adapt quickly will lead the charge, while those that cling to outdated technologies may fall behind.
- Innovation Acceleration: New materials will drive innovation, enabling more powerful and efficient devices.
- Economic Impact: The commercialization of these materials will create new markets and job opportunities.
- Sustainability: Enhanced efficiency and durability contribute to more sustainable electronic solutions.
As research continues and these materials become more accessible, the landscape of electronics will evolve, ushering in a new era of technological advancement.